go to top scroll for more

Tamessa - Turning up the heat in electronics

Reference Number
InnUK/102016/01
Title
Tamessa - Turning up the heat in electronics
Status
Completed
Energy Categories
Not Energy Related
Energy Efficiency(Industry)
Other Cross-Cutting Technologies or Research(Environmental, social and economic impacts)
Research Types
Applied Research and Development
Science and Technology Fields
ENGINEERING AND TECHNOLOGY (Electrical and Electronic Engineering)
UKERC Cross Cutting Characterisation
Not Cross-cutting
Principal Investigator
Project Contact
Microsemi Semiconductor Limited
Award Type
Collaborative Research & Development
Funding Source
Innovate UK
Start Date
01 January 2015
End Date
31 December 2016
Duration
24 months
Total Grant Value
£262,982
Industrial Sectors
Region
South West
Programme
Competition Call: 1402_CRD_HVM_MESF - Manufacturing Electronic Systems of the Future - CRD. Activity Manufacturing electronic systems of the future (CRD)
Investigators
Principal Investigator
Project Contact, Microsemi Semiconductor Limited
Other Investigator
Project Contact, National Physical Laboratory (NPL)
Project Contact, Gwent Electronic Materials Limited
Web Site
Objectives
Abstract
The Tamessa project represents a step change in harsh environment electronic assembly. Tamessa will develop a integrated system will eliminate the need to use expensive & heavy ceramic technologies in applications up to 225Deg C and allow the integration of bespoke through hole components. Typical applications benefiting from this system are aerospace, automotive, offshore & power management or other areas were electronics are subjected to high temperature, salt and hydrocarbons. OEMs will benefit from 30% reduction in board cost, 50% reduction in board weight and 95% reduction in tooling NRE cost. Energy cost associated with manufacture are signifcantly reduced.The Tamessa project represents a step change in harsh environment electronic assembly. Tamessa will develop a integrated system will eliminate the need to use expensive & heavy ceramic technologies in applications up to 225Deg C and allow the integration of bespoke through hole components. Typical applications benefiting from this system are aerospace, automotive, offshore & power management or other areas were electronics are subjected to high temperature, salt and hydrocarbons. OEMs will benefit from 30% reduction in board cost, 50% reduction in board weight and 95% reduction in tooling NRE cost. Energy cost associated with manufacture are signifcantly reduced.The Tamessa project represents a step change in harsh environment electronic assembly. Tamessa will develop a integrated system will eliminate the need to use expensive & heavy ceramic technologies in applications up to 225Deg C and allow the integration of bespoke through hole components. Typical applications benefiting from this system are aerospace, automotive, offshore & power management or other areas were electronics are subjected to high temperature, salt and hydrocarbons. OEMs will benefit from 30% reduction in board cost, 50% reduction in board weight and 95% reduction in tooling NRE cost. Energy cost associated with manufacture are signifcantly reduced.
Data

No related datasets

Projects

No related projects

Publications

No related publications

Added to Database
04/12/15