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Alternative Jointing Techniques

Reference Number
NIA_SSEN_0054
Title
Alternative Jointing Techniques
Status
Completed
Energy Categories
Other Power and Storage Technologies(Electricity transmission and distribution)
Research Types
Applied Research and Development
Science and Technology Fields
ENGINEERING AND TECHNOLOGY (Electrical and Electronic Engineering)
UKERC Cross Cutting Characterisation
Not Cross-cutting
Principal Investigator
Project Contact
Scottish Hydro Electric Power Distribution plc (SHEPD)
Award Type
Network Innovation Allowance
Funding Source
Ofgem
Start Date
01 July 2021
End Date
30 June 2022
Duration
ENA months
Total Grant Value
£92,394
Industrial Sectors
Power
Region
Scotland
Programme
Network Innovation Allowance
Investigators
Principal Investigator
Project Contact, Scottish Hydro Electric Power Distribution plc (SHEPD)
Industrial Collaborator
Project Contact, Scottish and Southern Energy plc
Web Site
Objectives
The proposed technology is to replace a liquid thermoset resin with a semi-solid thermoset putty compound that is pre moulded inside a clamshell. The clamshell is simply placed around the joint (once made), closed and the putty is cured either by application of heat, ultraviolet light or through another initiator (e.g. chemical) means. There is therefore no requirement to mix resins which can introduce variability and air entrapment in the cured resin. Liquid resins can cure either too quickly or too slowly if incorrectly mixed or if the mixing is performed on hot or cold days. The putty will be manufactured and pre-assembled in a factory environment resulting in high tolerances to ensure a repeatable chemical reaction takes place. There is little-to-no waste as the putty is pre-applied to the inside of the clamshell. The speed of operation is also reduced by making this a one-step process with the putty tailored to an idealised cure-time as per operator requirements. Stage 1 Proof of ConceptThe Scope is to develop the putty material to a proof of concept/component validation in a laboratory, experimenting with the same scale of joints that used currently.The output of stage 1 is to prove the feasibility that using a resin-based putty can be used to encapsulate a LV joint and withstand the electrical voltages.Output 1: Validate that it is feasible to create a mouldable putty solution that meets themechanical and electrical requirements of an LV joint. There will also be potential additional benefits in the following areas: -• Cost reduction and efficiencies operational time and effort• SHE (Safety, Health and Environment) impact The projects objectives are as follows;Develop RequirementsTo describe the specific requirements of the technology in terms of:material performance, process methodology needs, cost targets, process duration targets.• Product specification• Process specification / targets• Cost targetsInvestigateManufacture of a resin based putty system with standard curative systems.• Measure the ability to mould the joint between clam shells• Measure the base dielectric strength or other electrical requirements
Abstract
This project will Introduce the concept of a new cable jointing system that will require a new methodology for installation compared to existing systems. The new learning will be based around process methodologies, new equipment to use and potentially measuring when the product is cured and when it is safe to backfill.
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Added to Database
19/10/22