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Reference Number InnUK/102287/01
Title Intelligent and Efficient Thermal Managed Power Module for Low Carbon Vehicles
Status Completed
Energy Categories ENERGY EFFICIENCY(Transport) 100%;
Research Types Applied Research and Development 100%
Science and Technology Fields ENGINEERING AND TECHNOLOGY (Electrical and Electronic Engineering) 50%;
ENGINEERING AND TECHNOLOGY (Mechanical, Aeronautical and Manufacturing Engineering) 50%;
UKERC Cross Cutting Characterisation Not Cross-cutting 100%
Principal Investigator Project Contact
No email address given
Dynex Semiconductor Ltd
Award Type Collaborative Research & Development
Funding Source Innovate-UK
Start Date 01 November 2015
End Date 31 October 2017
Duration 24 months
Total Grant Value £427,949
Industrial Sectors
Region East Midlands
Programme Competition Call: 1409_CRD_LCV_IDP11 - Adapting cutting-edge technologies - IDP11. Activity Adapting cutting-edge technologies -IDP11
 
Investigators Principal Investigator Project Contact , Dynex Semiconductor Ltd (53.423%)
  Other Investigator Project Contact , University of Nottingham (46.577%)
Web Site
Objectives
Abstract The advantages brought by Hybrid and Electric Vehicles (HEV/EV) such as being environmentally friendly, less dependent on fossil fuels, cost effective in long term operation etc, HEV/EV has highly focused governments and car manufacturers. Power control is essential in HEV/EV powertrain systems of which the core part is the power IGBT modules. The requirements of modules are strict in electrical and thermal performance, efficiency and reliability. In this project, a power IGBT module incorporating intelligent driver, efficient thermal management concept and advanced packaging technologies for HEV/EV is developed. By combining Dynex Semiconductor's leading expertise in power semiconductors and the University of Nottingham's cutting edge research in enhanced heat transfer and cooling. A new power IGBT module with a flat heat pipe baseplate and intelligent gate driver using advanced bonding and joining technologies such as copper wires, silver sintering and ultrasonic welding will be developed. The module increases heat transfer efficiency by 20% compared with pin fin structures and simplifies cooling system by removing costly, unreliable parts and enhancing efficiency.The advantages brought by Hybrid and Electric Vehicles (HEV/EV) such as being environmentally friendly, less dependent on fossil fuels, cost effective in long term operation etc, HEV/EV has highly focused governments and car manufacturers. Power control is essential in HEV/EV powertrain systems of which the core part is the power IGBT modules. The requirements of modules are strict in electrical and thermal performance, efficiency and reliability. In this project, a power IGBT module incorporating intelligent driver, efficient thermal management concept and advanced packaging technologies for HEV/EV is developed. By combining Dynex Semiconductor's leading expertise in power semiconductors and the University of Nottingham's cutting edge research in enhanced heat transfer and cooling. A new power IGBT module with a flat heat pipe baseplate and intelligent gate driver using advanced bonding and joining technologies such as copper wires, silver sintering and ultrasonic welding will be developed. The module increases heat transfer efficiency by 20% compared with pin fin structures and simplifies cooling system by removing costly, unreliable parts and enhancing efficiency.
Publications (none)
Final Report (none)
Added to Database 03/01/18