Projects
Projects: Projects for Investigator |
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| Reference Number | EP/C003071/1 | |
| Title | Performance, degradation and defect structure of MOS devices using high-k materials as gate dielectrics | |
| Status | Completed | |
| Energy Categories | Energy Efficiency(Other) 100%; | |
| Research Types | Basic and strategic applied research 100% | |
| Science and Technology Fields | ENGINEERING AND TECHNOLOGY (Electrical and Electronic Engineering) 100% | |
| UKERC Cross Cutting Characterisation | Not Cross-cutting 100% | |
| Principal Investigator |
Professor J Zhang No email address given Engineering Liverpool John Moores University |
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| Award Type | Standard | |
| Funding Source | EPSRC | |
| Start Date | 01 February 2005 | |
| End Date | 31 March 2008 | |
| Duration | 38 months | |
| Total Grant Value | £191,097 | |
| Industrial Sectors | Electronics | |
| Region | North West | |
| Programme | Information & Communication Technology, Materials, Mechanical and Medical Eng, Physical Sciences | |
| Investigators | Principal Investigator | Professor J Zhang , Engineering, Liverpool John Moores University (100.000%) |
| Industrial Collaborator | Project Contact , University of Glasgow (0.000%) Project Contact , IMEC, Belgium (0.000%) Project Contact , International SEMATECH, USA (0.000%) Project Contact , NMRC - National Microelectronics Research Centre, Ireland (0.000%) |
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| Web Site | ||
| Objectives | ||
| Abstract | The transistors in successive generations of integrated circuits have increased in speed, use less power and cost less because of diminishing transistor sizes. Unfortunately, it is not possible to reduce the operating voltage with the same scaling factors as the physical size so the electric fields in the transistor have increased dramatically. The silicon dioxide which is used as the gate of these transistors is now so thin that a significant current flows through this insulating layer at normal operating voltages because of tunnelling. This increases power consumption and reduces reliability. Future transistor generations will need a gate dielectric of higher permittivity (high-k) that will allow a larger physical thickness to be used without increasing the equivalent electrical thickness. This is the most important single issue facing the development of integrated circuits at the moment. The high-k materials proposed by the industry (materials based on hafnium oxide are favouredat the moment) are physically and chemically very different to silicon dioxide. Considering the importance of this technological leap surprisingly little is known about their interface characteristics with silicon or about the trapping sites in the oxide. In this research programme three NW Universities will collaborate with IMEC in Belgium, SEMATECH in the USA, NMRC in Ireland, Imperial College and Glasgow University to achieve an understanding of the underlying science of these gate dielectrics. This will be done by applying both novel research tools and industry standard methods to analyse the interface and bulk trapping centres and to observe their evolution under electrical stress. A key issue will be the role of hydrogen and deuterium in these materials and the physical and electronic structure of the traps | |
| Data | No related datasets |
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| Projects | No related projects |
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| Publications | No related publications |
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| Added to Database | 01/01/07 | |
